Necessity of Cleaning the Mold
- Semiconductors such as IC, TR, Diode, etc should be encapsulated by EMC in order to protect from outside environments humidity, heat and mechanical impact.
- During the using by EMC, The surface of mold is contaminated because of more sticky problems, high temperature, oxidation of unsaturated bonds, impurities, lots of molding cycle, etc.
- According to high performance of EMC, Melamine Molding cleaning is the most effective and perfect method for eliminating mold stains.
Compounding Process
- Raw material
- Melamine Resin Synthesis I, II : Thermal Reaction, Adjusting of Polymerization
- Dehydration & Kneading : Mixing with Fillers, Releasing Agent
- Drying & Aging : Related to Resin Fluidity and Condensation
- Grinding : Mixing with Curing Agent and Lubricants
- Sieving & Packing : Mechanically Sifted and Packed with Silica-gel
- Product of STAGE A
- Molding Compound Input to Automatic Powder Forming Machine
- Production of Tablet Compound
- Sorting & Weighing & Packing
Specification of MCC
|
ITEM |
TRANSFER TYPE |
COMPRESSION TYPE |
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MOLDING METHOD |
Transfer Molding | Compression Molding | |||||
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GRADE |
MCP-1200 | MCP-1000 | |||||
|
TABLET SIZE |
Φ13㎜, Φ14㎜ |
Φ48㎜ | 38㎜ x 68㎜ x 7㎜ | ||||
|
Φ16㎜, Φ18㎜ |
Φ48㎜ (15g, 18g, 20g) | ||||||
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TABLET WEIGHT TOLERANCE |
Φ13㎜, Φ14㎜ - ±0.3g |
Φ48㎜ - ±5.0g | 38㎜ x 68㎜ x 7㎜ - ±5.0g | ||||
|
Φ16㎜, Φ18㎜ - ±0.4g |
Φ48㎜ (15g, 18g, 20g) - ±3.0g |
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CURING TIME |
Slow |
Standard |
Fast | Slow | Standard | Fast | |
|
APPEARANCE |
Circular Cylinder | Parallelepiped / Circular Cylinder | |||||
|
COLOR |
White |
White |
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TABLET DENSITY |
1.2 ~ 1.5g/㎤ |
1.1 ~ 1.4g/㎤ |
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|
FLOW |
Spiral Flow |
20 ~ 40inch |
Disc Flow |
80 ~ 110㎜ |
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MOLD DENSITY |
1.5 ~ 1.7g/㎤ |
1.4 ~ 1.6g/㎤ |
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MOLDED SHRINKAGE |
0.7 ~ 1.2% |
0.9 ~ 1.2% |
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|
HOT HARDNESS |
Min 70 at 175℃, 1000psi (Shore D) |
Min 70 at 175℃, 1000psi (Shore D) |
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STORAGE |
(Below) 25 ℃ |
(Below) 25 ℃ |
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|
SHELF LIFE |
1 year at around 25℃ under storage condition. |
1 year at around 25℃ under storage condition. |
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Cleaning Condition I – Standard Cleaning Condition
| ITEM | TRANSFER TYPE | COMPRESSION TYPE | |
| Pre-heating Temperature | 90 ~ 110℃ | - | |
| Mold Temperature | 160 ~ 190℃ | 160 ~ 190℃ | |
| Molding Pressure | 3 ~ 10MPa | 10 ~ 20MPa | |
| Cure Time (175℃) | Auto | 120 ~ 240sec | 150 ~ 210sec |
| Manual | 150 ~ 250sec | ||
| Recommended Number of shots | More than 7 shots | More than 7 shots | |
Cleaning Condition II – Curing Time Tablet of Transfer Type
Curing Temperature | Type of Curing | ||
| Slow | Standard | Fast | |
| 160℃ | 210 ~ 340sec | 160 ~ 260sec | 120 ~ 240sec |
| 170℃ | 150 ~ 260sec | 120 ~ 220sec | 100 ~ 200sec |
| 180℃ | 120 ~ 220sec | 100 ~ 200sec | 80 ~ 170sec |
| 190℃ | 90 ~ 200sec | 80 ~ 170sec | 70 ~ 140s |
**The above curing time could be varied among the actual molding condition.
Storage and Packing
- MCP is very sensitive to moisture. Unpack just before starting use.
- To be into the dry and cool place, without direct sunshine. It is stable for 1 year at around 25℃(77℉)under a air-condition room.
- Opened the sealing, it’s recommended to exhaust with in 1-2 weeks at least.
- Net weight 10kgs per a carton box with Silica-gel, polyethylene sealing bag inside.
- MCP is sealed up in a polyethylene zipper bag.
Handling Procedure
- Wear gloves when handling the MCP, Because it is moisture and temperature sensitive.
- MCP is recommended to keeps the well ventilated area and wear a safe mask, it might produce vapors including a small amount of Formaldehyde.
- After opening the sealed PE bag, it should be used as soon as possible and stored at room temperature with sealed state.
Advantages of MCP
1. Cost Reduction.
2. Various Manufacturing Method.
3. Compound Manufacture Possibility with Special Properties.
4. Excellent Cleaning Performance.
5. Superiority of Work ability Performance.